Cooling Methods for High-Power Electronic Systems
DOI:
https://doi.org/10.2478/v10144-011-0014-xKeywords:
Electronic packaging thermal management, electronics cooling, power dissipation, power semiconductor devicesAbstract
Thermal management is a crucial step in the design of power electronic applications, especially railroad traction and automotive systems. Mass/size parameters, robustness and reliability of the power electronic system greatly depend on the cooling system type and performance. This paper presents an approximate parameter estimation of the thermal management system required as well as different commercially available cooling solutions. Advantages and drawbacks of different designs ranging from simple passive heatsinks to complex evaporative systems are discussed.References
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Copyright (c) 2011 Andrei Blinov, Dmitri Vinnikov, Tõnu Lehtla (Author)
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